EMI Shielding & Thermal Dissipation EP Material
Advanced Functional Material Combining EMI Shielding and Thermal Management for Automotive Electronics
Overview
As a high-performance engineering plastic based on PC, PPS, PA, and PBT, this material reduces electromagnetic interference and efficiently dissipates heat, contributing to the stable operation and improved design efficiency of robotic electronic systems.
Why LG Chem’s EMI Shielding & Thermal Dissipation EP Material?
Stable Robot Operation
- • EMI shielding reduces interference and malfunction risks between electronic components
- • Supports stable signal processing for sensitive electronic systems
Thermal Management and Component Protection
- • Efficiently dissipates heat and helps suppress temperature increases in components
- • Contributes to reducing performance degradation and failure risks during prolonged operation
Simplified Design and Assembly
• Integrates EMI shielding and thermal management into a single material, helping reduce component count and design complexity
EMI Shielding
Reduces EMI interference and enhances the stability of electronic systems.
Thermal Conductivity
Dissipates heat from heat-generating components and suppresses temperature rise.
Multiple Base Material Platforms
Available in PC, PPS, PA, and PBT platforms, enabling property selection according to application requirements.
Functional Integration
Provides both EMI shielding and thermal management performance in a single material.